Welcome to TANSEMI. By accessing or using our website and services, you agree to comply with the following Terms of Use.

Use of Website
The content provided on this website is for general informational and business purposes only. Users agree not to misuse the website or attempt unauthorized access to systems or data.

Intellectual Property
All content, including text, graphics, logos, designs, and technical materials, belongs to TANSEMI unless otherwise stated. Unauthorized reproduction or distribution is prohibited.

Service Information
We strive to provide accurate and up-to-date information regarding our semiconductor assembly, wire bonding, and manufacturing services. However, we do not guarantee that all information is free from errors or omissions.

Limitation of Liability
TANSEMI shall not be held responsible for any direct, indirect, or incidental damages arising from the use of this website or reliance on its content.

Third-Party Services
Our website may include references or links to third-party services and websites. We are not responsible for their content, security, or practices.

Changes to Terms
We reserve the right to modify these Terms of Use at any time without prior notice. Continued use of the website constitutes acceptance of the updated terms.

Governing Law
These Terms of Use shall be governed by applicable laws and regulations in the jurisdiction where the company operates.

Contact Information
For any questions regarding these Terms of Use, users may contact TANSEMI through official communication channels.